Credit Cards
Diameter
Flux Type
Melting Point
Type
Composition
Packaging
Manufacturer
Type Composition Diameter Melting Point Flux Type Packaging Manufacturer Specifications Alternatives
Wire Solder 0.3Ag, 0.7Cu, 0.04Co, Bal. Sn 0.4mm 217-227°C Low or No Halide Content Spool Koki Datasheet Click to View
Type Composition Diameter Melting Point Flux Type Packaging Manufacturer Specifications Alternatives
Wire Solder 0.3Ag, 0.7Cu, 0.04Co, Bal. Sn 0.8mm 217-227°C Low or No Halide Content Spool Koki Datasheet Click to View